Giesecke & Devrient has been awarded the “Future Digital Award” by Juniper Research in the category “Best Emerging Disruptive Technology/Platform” for “making a significant contribution to their sector and being poised to make considerable market impact in the future”. Stefan Auerbach, Group Executive Mobile Security at G&D, sees the award as “an excellent acknowledgement for our ongoing efforts to pave the way to Industry 4.0 for our clients. We are proud and honored that this has been awarded with one of the prestigious Juniper Awards. Our Secure Industrial Visibility solution supports industry information technology with high-end security as well as secure machine service and maintenance management for existing and upcoming production infrastructure.”

G&D has been accredited to be a "Mobile Connect Technology Vendor" for its LicentioID solution by the GSMA. Designation as a "Mobile Connect Technology Vendor" confirms that a supplier is compliant with major elements of the GSMA's Mobile Connect solution. G&D’s end-to-end solution LicentioID covers both the service backend and the Mobile Device and SIM based applet.

Giesecke & Devrient (G&D) has been certified by NXP Semiconductors for MIFARE DESFire EV1. This certification completes the product certification for MIFARE Classic and MIFARE4Mobile Version 2 which G&D received in 2015. G&D’s SIM platform SkySIM CX® Hercules now offers the entire MIFARE suite, thus enabling secure remote provisioning and management of MIFARE-based services for mobile network operators, trusted services managers and service providers.

Digital PCB Production using industrial inkjet printing

By Roel De Mondt, PhD, Agfa-Gevaert N.V.

Researchers from Swansea University have developed solar cells which can be printed onto cheap metal foil, making it a flexible and inexpensive way to generate solar power.

Panasonic Corporation announced today that the company has developed a soft, flexible, and stretchable[1] polymer resin film using its proprietary stretchable resin technology. The Company will also provide a transparent electrode material[2] and conductive paste[3] along with this insulating film.

This week ESMA confirmed Sean Smyth as keynote speaker for Advanced Functional & Industrial Printing (AFIP) 2016, which takes place on 2-3 March in Düsseldorf, Germany.

Mycronic AB is one of the first companies in Sweden to reach certification according to the EDGE (Economic Dividends for Gender Equality) global standard for workplace gender equality. Last month Mycronic was also awarded the Allbright Prize in recognition of its focused efforts in the diversity area.

Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, and Giesecke & Devrient (G&D), a leading international technology provider in the banknote, payment, secure communication and identity management sectors, today announced its collaboration for industrial security solutions and services. The two technology partners' first solution, demonstrated at the SPS IPC Drives in Nuremberg, focuses on anti-counterfeiting solutions for industrial products.

A low-cost, high-speed method for printing electronics using graphene and other conductive materials could open up a wide range of commercial applications.

UL has recently officially opened a printed wiring board (PWB) performance testing lab in Taipei. Incorporating the widely tested UL746 and UL796 safety certification, the lab will benefit local PWB businesses across downstream and upstream sectors by providing a full suite of product performance testing and authentication services.

Ericsson today announced a partnership with Giesecke & Devrient (G&D) to deliver a commercial end-to-end subscription management solution. Via a highly secure process, the system will enable the remote provisioning and management of mobile operator SIM profiles and policies. The joint solution will make it possible for mobile network operators (MNOs) to provide their business customers with a one-stop shop for global M2M connectivity services. In addition, by minimizing the complexity involved in setting up services across disparate regions, the collaboration will target businesses' need to deliver connected devices worldwide.