Toyochem Co., Ltd. (President: Satoru Takashima), a wholly-owned subsidiary of the Toyo Ink Group, announced today that they will be participating in JPCA Show 2015, or the 45th International Electronic Circuits Exhibition. The show will run from June 3 to 5 at the Tokyo Big Sight in Tokyo, Japan.
Electronic circuit and packaging technology is used in all electronics, and information and communication devices, having tremendous potential for widespread use in the future. Thus, the aim of the JPCA Show is to contribute to the overall development of the electronic circuit industry and related fields by presenting an exhibition of products, knowledge and solutions for electronics devices, IT devices and equipment, and large electronics (printed electronics, stretchable electronics, etc.).
At booth 2G-30, Toyochem will showcase its latest electronics-related materials that leverage the Toyo Ink Group's materials design and advanced processing technologies, and offer solutions developed to meet the electronics engineering needs of customers and end-users.
Key Products on Display
LIOELM™ TSS™ series of electromagnetic shielding films is specially designed to meet strict shielding demands. The TSS™200 series of shielding films provides a simplified two-layer shielding structure for superior gap-fill properties. The TSS™300 series is ideal for customers who require thin-type films. LIOELM™ TSC200 series of conductive adhesive sheets demonstrates excellent conductivity and strong adhesion.
LIOELM™ TCL500 / TSU™500 series of low dielectric materials reduces transmission losses by using an original low-dielectric resin and contributes to the widening or narrowing of gaps between printed-circuit lines.
An updated lineup of printed electronics solutions, such as REXALPHA™ RA FS series of high-resolution conductive silver pastes for fine circuit pattern formations, will also be on display.
Tech Showcase: Printed Electronics Trends & Adhesives for Electronic Components
Mr. Toshihiko Tanaka, technical manager of Toyo Ink SC Holdings Co.'s Group Technology Center, Development Division, will lead a seminar on the latest trends in printed electronics on June 3, from 2 to 2:30 p.m., at I-corner, East Hall 6. This seminar is part of the PEC (Printed Electronics Convention) Japan program.
Seminar Summary: Printed electronics (PE) has been expanding to a variety of applications. Today, touch panels have been driving the development of fine-pattern circuit technology, with 30 μm circuits already put to practical use. The Toyo Ink Group has a wealth of advanced PE expertise in prepress, materials design and postpress. Mr. Tanaka will speak on practical printed electronics and its possibilities, now and in the future.
Mr. Shota Mori of Toyochem's Polymer & Coating R&D Division, New Technology Department will introduce low-dielectric adhesive sheets for flexible printed circuit transmissions on June 5, from 2:50 to 3:20 p.m. at D-corner, East Hall 6. This seminar is part of the NPI Presentation program.
Seminar Summary: Toyochem has successfully developed an original resin that resolves the problems with transmission properties required for high-speed, high-frequency FPCs (flexible printed circuits). Mr. Mori will also introduce Toyochem's LIOELM™ TSU series of low-dielectric adhesive sheets for FPC applications
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