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Semiconductor CEOs Urge Congress to Enact Trade Promotion Authority to Spur Growth, Innovation

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today applauded the Bipartisan Congressional Trade Priorities and Accountability Act of 2015 (TPA-2015), legislation introduced today by Senate Finance Committee Chairman Orrin Hatch (R-Utah), Ranking Member Ron Wyden (D-Ore.), and House Ways and Means Committee Chairman Paul Ryan (R-Wis.). The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage. Additionally, SIA president and CEO John Neuffer released the following statement in support of the bill:


Anritsu Successfully Completes 4x4 MIMO Testing of GCT Semiconductor LTE-Advanced Single Chip

Anritsu announces it successfully completed testing of GCT Semiconductor's 4G LTE-Advanced chip, GDM7243Q, using Anritsu's MD8430A signaling tester with Rapid Test Designer (RTD). GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, offers an advanced FDD-TDD LTE Category 5/6/7 single chip, with the world's first 4X4 MIMO carrier aggregation for LTE. GDM7243Q's operation and 4X4 MIMO capabilities have been tested on Anritsu's signaling testing system.

Synopsys Announces Immediate Availability of Broad Portfolio of Silicon-Proven IP for TSMC 16-nm FinFET Plus Processes

  • DesignWare IP on TSMC 16FF+ Processes Enables Designers to Accelerate Development of Mobile and Enterprise SoCs
  • DesignWare Interface PHY IP portfolio for TSMC 16FF+ processes includes USB 3.0, 2.0 and HSIC; 16G PHY; PCI Express 4.0, 3.0 and 2.0; SATA 6G; HDMI 2.0; MIPI D-PHY; DDR4 and LPDDR4/3/2 IP
  • DesignWare Embedded Memories for the TSMC 16FF+ processes include high-speed, high-density and ultra high-density SRAM, Register File and ViaROM memory compilers
  • DesignWare STAR Memory System is optimized to provide high test coverage and efficient repair of FinFET-based memories

Peregrine Semiconductor Expands Automotive Product Portfolio

The UltraCMOS® PE423422, PE423641 and PE42359 RF Switches Boast AEC-Q100 Grade 2 Certification for Automotive Applications
Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, introduces two new UltraCMOS® RF switches that expand its existing portfolio of solutions for automotive applications. Peregrine's PE423422 and PE423641 are the newest components to join the PE42359 in meeting the AEC-Q100 requirements for Grade 2, meaning qualification for operation in the temperature range of -40 to +105 degrees Celsius. The PE423422 and PE423641 are designed for automotive infotainment and traffic safety applications, such as multimode compenser modules for infotainment systems and emergency communication systems.

TSMC Certifies Mentor Graphics Tools for Early Design Start in TSMC's 10nm FinFET Technology

Mentor Graphics Corp. (NASDAQ: MENT) today announced that TSMC and Mentor Graphics have reached the first milestone of their collaboration on 10nm EDA certification. Calibre® physical verification and design for manufacturing (DFM) platform, and the Analog FastSPICE™ (AFS™) Circuit Verification Platform, including AFS Mega, are certified by TSMC based on the most current version of 10nm design rules and SPICE models. New tool feature enhancement based on 10nm process requirements has been made in Olympus-SoC™ digital design platform with TSMC validation, and certification of full chip integration is actively on-going. In addition to 10nm, Mentor has also completed 16FF+ version 1.0 certification of the Calibre, Olympus-SoC and AFS platforms. These certifications provide designers with the earliest access to signoff technology optimized for TSMC's most advanced process nodes, with improved performance and accuracy.

TSMC Certifies ANSYS Power Integrity And Electromigration Solutions For 10nm FinFET Early Design Start

ANSYS, Inc. (NASDAQ: ANSS) announced today that its ANSYS® RedHawk™ and ANSYS Totem™ products are certified by TSMC for the most current version of 10-nanometer (nm) FinFET Design Rule Manual (DRM) and SPICE models, addressing the power and performance requirements for mobile, computing and networking applications. TSMC has certified these solutions for static and dynamic voltage drop analysis and advanced signal and power electromigration (EM) verification to meet the 10-nanometer requirements.


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