Company to Present Speakers, Solutions Throughout North America
TE Connectivity (TE), a world leader in connectivity, today announced that it will have a major presence at multiple wireless industry conferences during the month of April with appearances at ACUTA, the LTE Innovation Summit, BICSI Canada, and the Wireless Infrastructure Show.
TE will exhibit its FlexWave all-digital distributed antenna systems (DAS) with the CPRI digital interface unit and their active integration panel (AIP) at ACUTA, BICSI Canada, and the Wireless Infrastructure Show. Additionally, TE speakers will present the following sessions:
ACUTA, Atlanta, Ga. –Bryan Kennedy, TE sales manager, presents "Public Safety DAS at a University: Best Practices" on Monday, April 20, from 1:15-2:15 p.m.
LTE Innovation Summit II, San Diego, Calif. Phil Wala, TE principal engineer, will present "The Role of DAS in LTE-Advanced Deployment" on Wednesday, April 22, from 5:30-6:00 p.m.
BICSI Canada, Ottawa, Canada –Shahbaz Salaria, TE sales manager, will present "In-Building Wireless Fundamentals" on Tuesday, April 28, from 10:30-11:30 a.m.
The Wireless Infrastructure Show, Hollywood, Fla. Phil Wala, TE principal engineer, will present "On the Edge of the Data Tsunami" on Tuesday, April 28, from 11:00 a.m. – 12:00 p.m. And Mark Kerschner, TE senior product manager, will present "Mobile Network Densification" on Wednesday, April 29, from 2:30-3:30 p.m.
"We're delighted to be recognized experts in wireless technology, trends, and applications. We are proud to be sharing this expertise with our customers and partners at industry events," said Peter Wraight, vice president and general manager of TE Wireless. "By sharing information with the market in this way, we help service providers and enterprises solve key challenges in wireless coverage."
www.te.com
